NedCard – Press release MicroSON®-3

NedCard Launches First UHF RFID Package, MicroSON®-3 SMD for Industrial Applications. The package is robust, reliable, small, and compatible with leading RFID chip solutions in the market.

WIJCHEN, Netherlands, May 8, 2018 – NedCard, experienced partner in RFID, today announced its first UHF (RAIN) RFID package, MicroSON®-3 SMD for industrial applications. MicroSON®-3 is a small outline no-leads (SON) package that can be embedded into industrial applications via printed circuit board, or PCB.

The MicroSON®-3 is small and very thin, yet robust enough to withstand harsh industrial processes and temperatures as high as 85°C (185°F). It is a near chip scale plastic encapsulated package with a copper lead frame substrate. The leadless package makes electrical contact by soldering the bottom surface terminals to the PCB. The small size of the MicroSON®-3 design makes it a perfect package for leading RAIN RFID tag chips like the Monza® R6-P from Impinj.

“RFID-enabled tracking in industrial applications helps companies automate item identification and data capture to improve quality, efficiency, and work processes,” said Frans Geurts, CEO of NedCard. “RAIN RFID delivers tangible benefits to the industrial sector. Tracking reusable items and tools saves time and replacement costs. Even industrial work-in-progress can be identified and tracked using RFID technology.”

Source: NedCard – Press release MicroSON®-3

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